Electronic Packaging must have a complimentary base of solid Mechanical
Engineering for a design to meet it's objectives. From commercial to
military applications, you can be assured we understand and apply the up
front analytical work for your project to withstand the test of time. We
take the time to understand the application, it's environment, agency
certifications and manufacturing processes - upfront in the conceptual
stage. Physical space, centers of gravity and thermal management are just
a few of the many concepts that must be considered in the design phase.
At EC&M, Inc. we understand the materials and processes such that
you can be assured of the most reliable and cost effective design
possible. We take the time to understand your design
EC&M, Inc. has been involved in all aspects of
product certifications. Through our local testing agency we provide UL,
CSA and CE certifications when required.
In areas where a new design has not been previously introduced for
certification, we work with the appropriate testing agencies to generate
compliance specifications. In addition we provide analytical support for
Whether it's Mil-Spec, COTS or industry standard we have experience to
provide the certification and testing as required.
Utilizing the test facilities at Binghamton University,
we provide both Shock/Vibration testing and Thermal Stress
here to visit Binghamton University's testing facilities.
|Specialty Testing (Zinc
As power designs become more compact - that
is closer lead spacing and tighter circuit line proximity - dislodged
metallic plating has created shorting anomalies resulting in
premature product failure. To overcome failure modes of this nature,
EC&M designs it's product to minimize these conditions and has
developed testing methodologies to determine failure mode impact.
Please contact us for more information in regards to our "Zinc
Whisker" test methodology and failure analysis.
Engineering Analysis & Design
- Pro/Engineer - Mechanical Design
including sheet metal, castings, injection molding, extrusions,
heat sinks, connectors, cabling.
- Pro/Mechanical & Analysis - Mechanical
Analysis including vibration, thermally induced stress, tolerance
- Flotherm & Auto thermal - Thermal
Analysis including component to system level thermal management
analysis, heat sink design and fan selection.
- Ansoft - Finite Element Modeling and analytical software
utilized in the development of magnetics.
- MAPLE - Mathematical Symbolic Solver.
- MathCAD - Math Analysis, graphical
simulation. Vers 2002
- PSpice - Circuit Simulation &
- P-cad - Electrical Simulation,
Schematics, Card & Board Layout. Vers 9,13,2001.
- Altera Max Plus Asic Design - Chip
level design and layout, modeling & simulation, VHDL & AHDL,
- AutoCAD - Mechanical Design &
Layout. Vers-9 to 2002