Welcome to Excalibur Capital & Manufacturing, Inc. Complete electronic packaging engineering design service.


Electronic Packaging


Engineering Services
Electronic Packaging
Analytical Services
MFG Services








General Overview:

EC&M provides a complete electronic packaging engineering design service. Our expertise is centered around system and sub-assembly designs. Which includes Power Electronic Development, Analog to Digital Control Circuitry, Card Cage design, Module, Card and Board Layout, Cable & Connector Development.

In The Power Areas.............

Our specialty is high density packaging, high efficient switch mode power supply design. We specialize in low EMI emission and High Transient Responding Converters. Power Supply designs have included densely packaged circuitry ranging from a few mill watts to several thousand watts. In addition we have gained core experience in high frequency transformer development.

Power Development Products Have Included:

  • Supplies for high end servers, routers & low end peripherals.

  • High Frequency Ballasts.

  • Integrated PCB Magnetics.

  • Stand up converters and brick type designs.

  • Rapid NiCad Battery chargers.

In The Packaging Areas:

Engineering and layout services range from single layer boards to highly complex multi-layer boards. From Through Hole to Surface Mount Technologies we can service your needs. Raw board layouts include single layer, multi-layer and hybrid SMT and Through Hole designs. Our extensive SMT libraries can be customized to your assembly operations.

Electronic Packaging Products Have Included:

  • High Density SMT Designs for the Server Industry.

  • Large Board , 36 layer designs.

  • Control System packaging for the energy industry.

  • Chip Substrate Layout and Design.

  • Flex Circuit Chip Carriers.



110 Day Place, Endicott, New York 13760 Phone: (607) 748-5550 Fax: (607) 748-5552
           ?E-Mail  EC&M with questions or comments.        Last updated Friday January 31, 2003 16:35