EC&M provides a complete electronic
packaging engineering design service. Our expertise is centered around
system and sub-assembly designs. Which includes Power Electronic
Development, Analog to Digital Control Circuitry, Card Cage design, Module, Card
and Board Layout, Cable & Connector Development.
In The Power
Our specialty is high density packaging, high efficient switch mode
power supply design. We specialize in low EMI emission and High Transient
Responding Converters. Power Supply designs have included densely packaged
circuitry ranging from a few mill watts to several thousand watts. In
addition we have gained core experience in high frequency transformer
Power Development Products Have
Supplies for high end servers, routers
& low end peripherals.
High Frequency Ballasts.
Integrated PCB Magnetics.
Stand up converters and brick type
Rapid NiCad Battery chargers.
In The Packaging
Engineering and layout services range from single layer boards to
highly complex multi-layer boards. From Through Hole to Surface Mount
Technologies we can service your needs. Raw board layouts include single
layer, multi-layer and hybrid SMT and Through Hole designs. Our extensive
SMT libraries can be customized to your assembly operations.
Electronic Packaging Products Have
High Density SMT Designs for the Server
Large Board , 36 layer designs.
Control System packaging for the energy
Chip Substrate Layout and Design.
Flex Circuit Chip Carriers.